At present, electronic heat dissipation substrates are used in two aspects: industrial printing curing and sterilization.
| Material | Substrate Thickness (mm) | DAM Thickness (mm) | Circuit Process | Metallization Spec. |
Al2O3,AlN |
0.25~0.5 | 0.3~0.5 | Thick film by printing, thin film by photolithography | Thick film-Silver circuit |
| - | - | - | - | Thin film-Copper plating/Golden circuit |
Currently, it is widely used in the AR/VR function of the rear lens of mobile phones, and the front lens is equipped with a 3D sensor to provide biometric identification and ranging functions.
| Material | Substrate Thickness (mm) | DAM Thickness (mm) | Circuit Process | Metallization Spec. |
Al2O3,AlN |
0.25~0.5 | 0.3~0.5 | Thin film by photolithography | Thin film-Copper plating/Golden circuit |
Applied to high-power electric conversion mechanisms such as electric vehicles.
| Material | Substrate Thickness (mm) | DAM Thickness (mm) | Circuit Process | Metallization Spec. |
Al2O3,AIN,Si3N4 |
0.38~1.0 above | Thin film by photolithography | Thin film-Copper plating/Golden circuit | 0.1~0.6mm |
Applied to 5G high-frequency communication components.
| Material | Substrate Thickness (mm) | DAM Thickness (mm) | Circuit Process | Metallization Spec. |
Al2O3 |
0.38~1.0 above | Thin film by photolithography | Thin film-Copper plating/Golden circuit | 0.05~0.1mm |