Ceramic Thick Film SubstrateThick film substrate
In addition to a complete thick film substrate solution, JST can also provide thick film printing technology. From laser process to circuit firing, JST can meet the diverse needs of customers for electronic heat dissipation substrates
The available production specifications are as follows:
| Item | Spec. | Remark |
| Material | AlN, Al2O3 | - |
| 4.5"Size (XYZ) | 4.5" *4.5" *0.38 4.5" *4.5" *0.5 4.5" *4.5" *0.63 |
- |
| 5.0"Size (XYZ) | 5.0" *5.0" *0.38 5.0" *5.0" *0.5 |
- |
| Dia. (via hole) | 60~ 150 um | Related to substrate thickness |
| Circuit width and gap | 75~100 um | Related to the thickness of metallized circuit |
| Silver circuit | 15~20um | - |
| Solderability Spec. | 260o/10sec | - |
| Tension | #3M 600 | - |
| High temperature baking | 200o/2hr | - |
| Electrical full inspection | Flying-Probe open/short | - |