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Thin film substrate

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Thin film ceramic heat dissipating substrate

Thin film substrate

JST has complete equipment and technology of thin-film process. Starting from the original substrate material, JST can work with customers to cope with the ever-changing technological trend of electronic heat-dissipating substrates through various processes of laser, grinding, etching, etc., and towards the diverse development of in-vehicle automation and the original universe.
The available production specifications are as follows:

  • Buy substrate material

    Size: 5〜5.0"

    Thickness: 0.38/0.5 mm

  • Laser via/precut

    Dia.: 50~150um

  • Sputter Titanium Copper

    Ti:0.1um

    Cu:0.3~0.5um

  • Laminate

  • Photolithography & 3D dam

  • Plate copper

    Copper thickness: 35~300um

    Hole plating: 50~100um

  • Grind

    Ra<0.5um

  • Plate Ni, Silver, Au

    Ni: 3~7um

    Au >0.1um

  • Defilm

  • Etch

  • Fit (Photolithography)

  • Clean

  • Inspect

  • Pack

3D thin film substrate

3D thin film substrate

JST has complete equipment and technology of thin-film process. Starting from the original substrate material, JST can effectively solve the efficiency and yield of downstream packaging products by 3D structure design achieved through laser, grinding, etching, etc., and fitting technology.
The available production specifications are as follows:
 

  • Buy substrate material

    Size: 5〜5.0"

    Thickness: 0.38/0.5 mm

  • Laser via/precut

    Dia.: 50~150um

  • Sputter Titanium Copper

    Ti:0.1um

    Cu:0.3~0.5um

  • Laminate

  • Photolithography & 3D dam

  • Plate copper

    Copper thickness: 35~300um

    Hole plating: 50~100um

  • Grind

    Ra<0.5um

  • Plate Ni, Silver, Au

    Ni: 3~7um

    Au >0.1um

  • Defilm

  • Etch

  • Fit (Photolithography)

  • Clean

  • Inspect

  • Pack